Metalized nanotube tips improve through thickness thermal conductivity in adhesive joints

Journal of Nanoscience and Nanotechnology

Volumn 9, Issue 3, 2009, Pages 1727-1733

  Ganguli, Sabyasachi ^b   Sihn, Sangwook ^b   Roy, Ajit K ^a   Dai, Liming ^c   Qu, Liangti ^c  

^a WRIGHT PATTERSON AIR FORCE BASE   (United States)

^b UNIVERSITY OF DAYTON RESEARCH INSTITUTE   (United States)

^c UNIVERSITY OF DAYTON   (United States)

Author keywords

Carbon nanotubes; Interfaces; Thermal conductivity

Indexed keywords

ADHERENDS; ALIGNED NANOTUBES; CRITICAL PARAMETER; EPOXY ADHESIVES; HIGH THERMAL CONDUCTIVITY; IMPEDANCE MISMATCH; INTERFACES; JOINT CONFIGURATION; LEAN MANUFACTURING; LOAD TRANSFER; LONGITUDINAL AXIS; MOLECULAR DYNAMICS SIMULATIONS; PARAMETRIC STUDY; PROCESS DEVELOPMENT; ROOM TEMPERATURE; SYSTEM RELIABILITY; THERMAL PROPERTIES; TRANSVERSE THERMAL CONDUCTIVITY; VERTICALLY ALIGNED;

ADHESIVE JOINTS; CONDUCTING POLYMERS; DYNAMICS; EPOXY RESINS; MOLECULAR DYNAMICS; MULTIWALLED CARBON NANOTUBES (MWCN); REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; THERMAL CONDUCTIVITY; THERMAL LOAD; THERMOANALYSIS; THERMOELECTRICITY;

CARBON NANOTUBES;

EID: 67649232045     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2009.387     Document Type: Conference Paper

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