Characterisation of FIB milling yield of metals by SEM stereo imaging technique

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 1021-1024

  Ostadi, H ^a   Jiang, K ^a   Prewett, P D ^a  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

Focused ion beam (FIB) milling; Sputtering yield; Stereo imaging technique

Indexed keywords

CHARACTERISATION; COMMON MATERIALS; ELECTRONIC INDUSTRIES; FIB MILLINGS; FOCUSED ION BEAM (FIB) MILLING; FOCUSED-ION-BEAM SYSTEMS; KEY PARAMETERS; MICRO SYSTEMS; NANO-SCALE PATTERNING; NICKEL ALUMINAS; SEM; SPUTTERING YIELD; STEREO IMAGING TECHNIQUE;

ALUMINA; IMAGING TECHNIQUES; IONS; LITHOGRAPHY; MILLING (MACHINING); NICKEL ALLOYS; SPUTTERING;

FOCUSED ION BEAMS;

EID: 67349283817     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.01.056     Document Type: Article

References (11)

1. Nan Yao, Focused ion Beam Systems Basics and Applications, Cambridge University Press, Cambridge, 2007, pp. 31-67, 268-295.
2. Orloff J., Swanson L.W., and Utlaut M. Journal of Vacuum Science and Technology B 14 6 (1996) 3759-3763
3. Sigmund P. Phys. Rev. 184 (1969) 383-416
4. Nuver T.T., Karssen L.C., Rudolph H., Zeijlmans van Emmichoven P.A., and Niehaus A. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 179 (2001) 503-514
5. Miyagawa Y., Nakadate H., Djurabekova F., and Miyagawa S. Surface and Coatings Technology 158 (2002) 87-93
6. Mulders J.J.L., de Winter D.A.M., and Duinkerken W.J.H.C.P. Microelectronic Engineering 84 (2007) 1540-1543
7. Samak D., Fischer A., and Rittel D. Journal of Manufacturing Technology 56 1 (2007) 149-152
8. Mex software manual, Version 5.0.1 EN 01, 2008 ed. (Chapter 3).
9. Marinello F., Bariani P., Savio E., Horsewell A., and De Chiffre L. Measurement Science and Technology 19 (2008) 1-12
10. See: .
11. Kempshall B.W., Schwarz S.M., Prenitzer B.I., Giannuzzi L.A., Irwin R.B., and Stevie F.A. J. Vac. Sci. B 19 3 (2001) 749-754