Silicon template fabrication for imprint process with good demolding characteristics

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 700-704

  Kawata, Hiroaki ^a   Matsue, Masato ^a   Kubo, Kensuke ^a   Yasuda, Masaaki ^a   Hirai, Yoshihiko ^a  

^a Osaka Prefecture University   (Japan)

Author keywords

Anisotropic etching; Bosch process; Imprint template; Potassium hydroxide; Scalloping; Silicon deep etching

Indexed keywords

BOSCH PROCESS; DEMOLDING; ETCHING CONDITIONS; IMPRINT TEMPLATE; ISO PROPYL ALCOHOLS; MEASUREMENT SYSTEMS; MIXED SOLUTIONS; POLYMETHYLMETHACRYLATE; POTASSIUM HYDROXIDE SOLUTIONS; SCALLOPING; SIDE WALLS; TEMPLATE FABRICATIONS; THERMAL IMPRINTS;

ANISOTROPY; POTASSIUM; POTASSIUM HYDROXIDE; REACTIVE ION ETCHING; WALL FLOW;

ANISOTROPIC ETCHING;

EID: 67349233665     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.11.030     Document Type: Article

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