Identification of phases in Sn-Ag-Cu-In solder on Cu substrate interface

Kovove Materialy

Volumn 46, Issue 4, 2008, Pages 235-238

  Sebo P ^a   Svec P ^b   Janickovic D ^b   Moser, Z ^c  

^a INSTITUTE OF MATERIALS AND MACHINE MECHANICS   (Slovakia)

^b INSTITUTE OF PHYSICS   (Slovakia)

^c INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Copper; Interface; Lead free solder; Phase analysis; X scan

Indexed keywords

EID: 55149122897     PISSN: 0023432X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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