Modeling package-induced effects on molded Hall sensors

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 3, 2008, Pages 594-603

  Fischer, Sebastian ^a   Wilde, Jürgen ^b  

^a SensorDynamics AG   (Austria)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Hall; Modeling; Packaging materials; Packaging process; Sensors

Indexed keywords

ASSEMBLY PROCESS; COEFFICIENTS OF THERMAL EXPANSIONS; COMPLEX MATERIALS; DESIGN PROCESS; HALL; HALL COEFFICIENTS; HALL PLATES; HALL SENSORS; INDUCED STRESS; MATERIAL BEHAVIORS; MICRO-ELECTRO MECHANICAL SYSTEMS; MODELING; MODELING PACKAGES; MOLDING COMPOUNDS; NONLINEAR TEMPERATURES; OFFSET VOLTAGES; PACKAGING PROCESS; PIEZO-RESISTIVE; SENSITIVITY CHANGES; SENSOR PERFORMANCE; TEMPERATURE DEPENDENCIES; THERMO-MECHANICAL STRESS; TIME DEPENDENTS; TIME-DEPENDENT MATERIAL PROPERTIES;

HALL EFFECT DEVICES; MEMS; MICROELECTROMECHANICAL DEVICES; SENSORS; STRESSES; THERMAL EXPANSION;

PACKAGING MATERIALS;

EID: 67349225134     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.924241     Document Type: Article

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