Electrochemical dissolution of biomedical grade Ti6Al4V: Influence of stress and environment

CIRP Annals - Manufacturing Technology

Volumn 58, Issue 1, 2009, Pages 499-502

  Chandra, A ^a   Ryu, J J ^a   Karra, P ^a   Shrotriya, P ^a   Weik, T ^b  

^a Iowa State University of Science and Technology   (United States)

^b B Braun Melsungen AG   (Germany)

Author keywords

Electrochemical dissolution; Stress; Surface

Indexed keywords

AQUEOUS ENVIRONMENTS; BIOMEDICAL IMPLANTS; CONTACT LOADS; CREVICE CORROSIONS; ELECTROCHEMICAL DISSOLUTION; IN-PLANE STRESS; LIFE PREDICTIONS; MATERIAL REMOVALS; ORTHOPEDIC IMPLANTS; SINGLE ASPERITIES; STRESS DEPENDENTS; STRESS LEVELS; SURFACE DEGRADATIONS; TI-6AL-4V; WEAR DAMAGES;

DEGRADATION; SURFACES;

DISSOLUTION;

EID: 67349216042     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2009.03.114     Document Type: Article

References (14)

1. Hallab N.J., Messina C., Skipor A., and Jacobs J.J. Differences in the Fretting Corrosion of Metal-Metal and Ceramic-Metal Modular Junctions of Total Hip Replacements. Journal of Orthopaedic Research 22 (2004) 250-259
2. Hanawa T. Evaluation Techniques of Metallic Biomaterials in Vitro. Science and Technology of Advanced Materials 3 (2002) 289-295
3. Brown S.A. Fretting Corrosion Accelerates Crevice Corrosion of Modular Hip Tapers. Journal of Applied Biomaterials 6 (1995) 19-26
4. Schaaff P. The Role of Fretting Damage in Total Hip Arthroplasty with Modular Design Hip Joints-Evaluation of Retrieval Studies and Experimental Simulation Methods. Journal of Applied Biomaterials and Biomechanics 2 (2004) 121-135
5. Ohmori H., Katahira K., Nagata J., Mizutani M., and Komotori J. Improvement of Corrosion Resistance in Metallic Biomaterials using a New Electrical Grinding Technique. Annals of the CIRP 51 1 (2002) 491-494
6. Goldberg J.R., and Gilbert J.L. Electrochemical Response of CoCrMo to High Speed Fracture of its Metal Oxide Using an Electrochemical Scratch Test Method. Journal of Biomedical Material Research 37 (1997) 421-431
7. Tortonese M., and Kirk M. Characterization of Application Specific Probes For SPMs. Proceedings of SPIE, 3009 (1997) 53-60
8. Chandra A., Mitchell A., Shrotriya P., and Lucca D.A. Stress Assisted Dissolution of Biomedical Grade CoCrMo: Influence of Contact Loads and Residual Stresses. Annals of CIRP 56 1 (2007) 565-568
9. Yu H.H., and Suo Z. Stress-dependent Surface Reactions And Implications for a Stress Measurement Technique. Journal of Applied Physics 87 3 (2000) 1211-1221
10. Che W., Bastawros A.-F., and Chandra A. Surface Evolution During the Chemical Mechanical Planarization of Copper. Annals of the CIRP 55 1 (2006) 605-608
11. Ryu JJ. Surface Damage of Metallic Implant due to Mechanical Loading and Chemical Reactions. Ph.D. Thesis. Iowa State University; 2008.
12. Evans C.J., Paul E., Dornfeld D., Lucca D.A., Byrne G., Tricard M., Klocke F., Dambon O., and Mullany B.A. Material removal mechanisms in lapping and polishing. Annals of the CIRP 52 2 (2003) 611-634
13. Wang C., Sherman P., Chandra A., and Dornfeld D. Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization. Annals of the CIRP 54 1 (2005) 309-312
14. Chandra A., Karra P., Bastawros A.F., Biswas R., Sherman P.J., Armin S., and Lucca D.A. Prediction of Scratch Generation in Chemical Mechanical Planarization. Annals of CIRP 58 1 (2008) 566-569