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Volumn 57, Issue 1, 2008, Pages 559-562

Prediction of scratch generation in chemical mechanical planarization

Author keywords

Agglomeration; Defectivity; Planarization

Indexed keywords

AGGLOMERATION; DEFORMATION; OPTIMIZATION; SLURRIES; SURFACE DEFECTS;

EID: 43749114022     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2008.03.130     Document Type: Article
Times cited : (68)

References (14)
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    • Effects of Abrasive Size Distribution in Chemical Mechanical Planarization: Modeling and Verification
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    • A Scratch Intersection Model of Material Removal During Chemical Mechanical Planarization (CMP)
    • Che W., Guo Y.J., Chandra A., and Bastawros A. A Scratch Intersection Model of Material Removal During Chemical Mechanical Planarization (CMP). Journal of Manufacturing Science and Engineering 127/3 (2005) 545-554
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  • 12
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    • Modeling the Effects of Abrasive Size Distribution, Adhesion and Surface Plastic Deformation on Chemical-Mechanical Polishing
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    • Use of Slurry Colloidal Behavior in Modeling of Material Removal Rates in CMP
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.