Fabrication of organic flexible electrodes using transfer stamping process

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 586-589

  Chan, Bin Da ^a   Hsieh, Kuo Huang ^a   Yang, Sen Yeu ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Micro contact; Organic flexible electronics; Transfer stamping

Indexed keywords

ADHESION FORCES; COATING CHARACTERISTICS; CONDUCTIVE POLYMERS; ELASTOMERIC MOLDS; ELECTRONIC COMPONENTS; FINITE-ELEMENT METHODS; FLEXIBLE ELECTRODES; MICRO CONTACT; MICRO-SCALE; N-O COMPLEXES; ORGANIC FLEXIBLE ELECTRONICS; ORGANIC INTEGRATED CIRCUITS; PEDOT:PSS; PET SUBSTRATES; RESIDUAL LAYERS; SILVER PASTES; STAMPING PROCESS; TRANSFER STAMPING;

CONDUCTING POLYMERS; ELECTRODES; INTEGRATED CIRCUITS; MOLDS; ORGANIC LIGHT EMITTING DIODES (OLED); POLYETHYLENE TEREPHTHALATES; SILVER;

STAMPING;

EID: 67349133470     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.12.056     Document Type: Article

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