Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

International Journal of Fracture

Volumn 156, Issue 1, 2009, Pages 75-96

  Chiu, T C ^a   Lin, H C ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Complex stress intensity factor; Contact; Electronic package; Inner pressure; Interface fracture; Three dimensional cracks; Virtual crack closure technique

Indexed keywords

COMPLEX STRESS INTENSITY FACTOR; CONTACT; ELECTRONIC PACKAGE; INNER PRESSURE; INTERFACE FRACTURE; THREE-DIMENSIONAL CRACKS; VIRTUAL CRACK CLOSURE TECHNIQUE;

ASPHALT PAVEMENTS; CRACK PROPAGATION; CRACK TIPS; DIES; JOINTS (STRUCTURAL COMPONENTS); MECHANICS; PHASE INTERFACES; SILICON COMPOUNDS; STRAIN RATE; STRENGTH OF MATERIALS; STRESS INTENSITY FACTORS; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL;

CRACK CLOSURE;

EID: 67349106697     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-009-9348-1     Document Type: Article

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