Effect of laser irradiation on generation and growth of whiskers in tin-electroplated film

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 73, Issue 3, 2009, Pages 226-233

  Mitooka, Yutaka ^a   Murakami, Koji ^a   Hino, Makoto ^a   Takamizawa, Masao ^b   Takada, Jun ^c  

^a Industrial Technology Research Institute of Okayama Prefectural Government   (Japan)

^b OM Sangyo Co Ltd   (Japan)

^c OKAYAMA UNIVERSITY   (Japan)

Author keywords

Intermetallic compound; laser irradiation; residual stress; Tin plating; Whisker

Indexed keywords

AS-PLATED FILMS; COPPER SUBSTRATES; COPPER-TIN INTERMETALLIC COMPOUND; DIODE LASERS; ELECTROPLATED FILMS; GENERATION AND GROWTH; INTERMETALLIC COMPOUND; LASER IRRADIATION; LASER IRRADIATIONS; NONUNIFORMITY; PLATED FILMS; STRESS FIELD; TIN FILMS; UNIFORM LAYER; WHISKER; X-RAY DIFFRACTION METHOD;

ELECTROPLATING; FILM GROWTH; IRRADIATION; LASERS; METALLIC FILMS; RADIATION; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; TIN; TIN PLATE;

COPPER;

EID: 66149091051     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.73.226     Document Type: Article

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