Mechanism of generation and growth of whiskers on tin electroplating

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 72, Issue 3, 2008, Pages 168-175

  Murakami, Koji ^a   Hino, Makoto ^a   Takamizawa, Masao ^b   Nakai, Kiyomichi ^c  

^a Industrial Technology Research Institute of Okayama Prefectural Government   (Japan)

^b OM Sangyo Co Ltd   (Japan)

^c EHIME UNIVERSITY   (Japan)

Author keywords

Diffusion; Intermetallic compound; Residual stress; Tin plating; Whisker

Indexed keywords

BACKSCATTERING DIFFRACTION; TIN ELECTROPLATING; WHISKER ORIENTATION;

BACKSCATTERING; CRYSTAL WHISKERS; INTERMETALLICS; OXIDE FILMS; RESIDUAL STRESSES; SUBSTRATES; X RAY DIFFRACTION;

TINNING;

EID: 42349093957     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.72.168     Document Type: Article

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