Effect of lead co-deposition on the whisker growth on electrodeposited tin film

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 72, Issue 3, 2008, Pages 229-235

  Takamizawa, Masao ^a   Naka, Toshihide ^a   Hino, Makoto ^b   Murakami, Koji ^b   Mitooka, Yutaka ^b   Nakai, Kiyomichi ^c  

^a OM Sangyo Co Ltd   (Japan)

^b Industrial Technology Research Institute of Okayama Prefectural Government   (Japan)

^c EHIME UNIVERSITY   (Japan)

Author keywords

Lead free; Phosphor bronze substrate; Tin electroplating; Tin whisker

Indexed keywords

PHOSPHOR BRONZE SUBSTRATES; TIN ELECTROPLATING; TIN WHISKERS; WHISKER GROWTH;

CRYSTAL WHISKERS; ELECTROPLATING; INTERMETALLICS; METALLIC FILMS; SUBSTRATES; X RAY DIFFRACTION;

TIN PLATE;

EID: 42349103790     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.72.229     Document Type: Article

References (1)

1. R. Kawanaka, Y. Fujiwara, K. Tsuji, S. Ito and Y. Ihara: Suzu Uisuka seityou purosesunokaimeitotaisaku (R&D Planning, 2006) PP. 11.