Fabrication of polymer silver conductor using inkjet printing and low temperature sintering process

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 4, 2008, Pages 291-296

  Wu, S P ^a   Yung, K C ^b   Xu, L H ^a   Ding, X H ^c  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^c Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd   (China)

Author keywords

Conductor; Inkjet printing; Microstructure; Polymer; Submicrometer metallic powders

Indexed keywords

ABS RESINS; ADHESION; BOND STRENGTH (MATERIALS); CONDUCTIVE MATERIALS; CRYSTALS; GRAIN SIZE AND SHAPE; INORGANIC COATINGS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; PARTICLE SIZE; POLYMERS; POWDERS; PRINTING; PRINTING PRESSES; RESINS; SINTERING; SURFACE DIFFUSION; X RAY ANALYSIS;

ADHESION STRENGTHS; CONDUCTIVE INKS; CONDUCTOR; CRYSTAL GRAINS; DISPERSIBILITY; HIGH ADHESIONS; INKJET PRINTING; INKJET PRINTING PROCESSES; INKJET PRINTING SYSTEMS; INKJET PRINTINGS; INTERPARTICLE CONNECTIVITIES; LONG-RANGE; LOW RESISTIVITIES; LOW-TEMPERATURE SINTERING; ON-DEMAND; RESISITIVITY; SILVER CONDUCTORS; SILVER PARTICLES; SILVER POWDERS; SINTERING PROCESSES; SUBMICROMETER METALLIC POWDERS; THERMAL BEHAVIORS; X-RAY DIFFRACTIONS;

SILVER;

EID: 54249141005     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.2004554     Document Type: Article

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