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Volumn , Issue , 2008, Pages 133-136

A comparison between V-ramp TDDB techniques for reliability evaluation

Author keywords

[No Author keywords available]

Indexed keywords

CONSTANT VOLTAGE STRESS TESTS; HIGH-Κ; MEASUREMENT DATA; RAMP TESTING; RELIABILITY EVALUATION; RELIABILITY MEASUREMENTS; TEST DATA; THICK OXIDES; TIME CONSTRAINTS; VOLTAGE TESTS;

EID: 64549095201     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2008.4796104     Document Type: Conference Paper
Times cited : (8)

References (7)
  • 1
    • 85190285323 scopus 로고    scopus 로고
    • A. Kerber et al., Impact of Failure Criteria on the Reliability Prediction of CMOS Devices With Ultrathin Gate Oxides Based on Voltage Ramp Stress, IEEE EDL, 27, No. 7, My 2006, pp. 609-611
    • A. Kerber et al., "Impact of Failure Criteria on the Reliability Prediction of CMOS Devices With Ultrathin Gate Oxides Based on Voltage Ramp Stress", IEEE EDL, Vol. 27, No. 7, My 2006, pp. 609-611
  • 2
    • 85190283082 scopus 로고    scopus 로고
    • A. Aal, Fast prediction of gate oxide reliability, IEEE Proc. Integrated Reliability Workshop, Final Report, 2006, pp. 182-185.
    • A. Aal, "Fast prediction of gate oxide reliability", IEEE Proc. Integrated Reliability Workshop, Final Report, 2006, pp. 182-185.
  • 3
    • 0019656053 scopus 로고
    • Time-Zero Dielectric Reliability Test By A Ramp Method
    • A. Berman, 'Time-Zero Dielectric Reliability Test By A Ramp Method", IEEE Proc. Int. Rel. Phys. Symp., 1981, pp. 204-209
    • (1981) IEEE Proc. Int. Rel. Phys. Symp , pp. 204-209
    • Berman, A.1
  • 4
    • 28744454314 scopus 로고    scopus 로고
    • New Approach of 90 nm Low- κ Interconnect Evaluation using a Voltage Ramp Dielectric Breakdown Test
    • O. Aubel et al., "New Approach of 90 nm Low- κ Interconnect Evaluation using a Voltage Ramp Dielectric Breakdown Test", IEEE Proc. Int. Rel. Phys. Symp., 2005, pp. 483-489
    • (2005) IEEE Proc. Int. Rel. Phys. Symp , pp. 483-489
    • Aubel, O.1
  • 5
    • 85190235353 scopus 로고    scopus 로고
    • A. Aal, Fast Wafer Level Reliability Assessment Of Ultra Thick Oxides Under Impact Ionization Conditions, IEEE Proc. Integrated Reliability Workshop, Final Report, 2007, pp. 117-120
    • A. Aal, "Fast Wafer Level Reliability Assessment Of Ultra Thick Oxides Under Impact Ionization Conditions", IEEE Proc. Integrated Reliability Workshop, Final Report, 2007, pp. 117-120
  • 6
    • 34250720007 scopus 로고    scopus 로고
    • Accurate Characterization On Intrinsic Gate Oxide Reliability Using Voltage Ramp Tests
    • S. C. Fan et al., "Accurate Characterization On Intrinsic Gate Oxide Reliability Using Voltage Ramp Tests", IEEE Proc. Int. Rel. Phys. Symp., 2006, pp. 625-626
    • (2006) IEEE Proc. Int. Rel. Phys. Symp , pp. 625-626
    • Fan, S.C.1
  • 7
    • 28744441002 scopus 로고    scopus 로고
    • Breakdown Characteristics Of Interconnect Dielectrics
    • G. S. Haase et al., "Breakdown Characteristics Of Interconnect Dielectrics", IEEE Proc. Int. Rel. Phys. Symp., 2005, pp. 466-473
    • (2005) IEEE Proc. Int. Rel. Phys. Symp , pp. 466-473
    • Haase, G.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.