A method of etching and powder blasting for microholes on brittle materials

Journal of Materials Processing Technology

Volumn 209, Issue 9, 2009, Pages 4390-4394

  Liao, Y S ^a   Chen, L C ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Brittle material; Mask; Photosensitive resin; Powder blasting

Indexed keywords

BRITTLE MATERIAL; CHEMICAL-ETCHING PROCESS; DESIRED POSITIONS; EROSION RATES; HIGH RESISTANCES; INNER LAYERS; MACHINING METHODS; MICRO-HOLES; PHOTO ETCHINGS; PHOTOSENSITIVE RESIN; POWDER BLASTING; PRINTING METHODS; PROTECTIVE LAYERS; RATE OF PRODUCTIONS; SECOND LAYERS; SUBSTRATE MATERIALS; TWO LAYERS; WET AND DRIES;

BLASTING; BRITTLENESS; DISSOLUTION; EROSION; LIGHT SENSITIVE MATERIALS; PHOTOSENSITIVITY; PLASMA ETCHING; POLYMERS; POWDERS; PROTECTIVE COATINGS; RESINS; SUBSTRATES; WET ETCHING;

DRY ETCHING;

EID: 64249112082     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.11.032     Document Type: Article

References (10)

1. Belloy E., Sayah A., and Gijs M.A.M. Oblique powder blasting for three-dimensional micromachining of brittle materials. Sens. Actuators A 92 (2001) 358-363
2. Belloy E., Thurre S., Walckers E., Sayah A., and Gijs M.A.M. The introduction of powder blasting for sensor and microsystem applications. Sens. Actuators A 84 (2000) 330-337
3. Belloy E., Sayah A., and Gijs M.A.M. Micromachining of glass inertial sensor. J. Micro-electromech. Syst. 11 1 (2002) 85-90
4. Dentinger P.M., Clift W.M., and Goods S.H. Removal of SU-8 photoresist for thick film applications. Microelectron. Eng. 61 62 (2002) 993-1000
5. Hutchings I.M., Macmillan N.H., and Rickerby D.G. Further studies of the oblique impact of a hard sphere against a ductile solid. Int. J. Mech. Sci. 23 (1981) 639-646
6. Liao Y.S., and Chen L.C. Determination of mask opening size in creating fluid hole on brittle material by double-side powder blasting. Int. J. Adv. Manuf. Technol. 29 (2006) 511-517
7. Sin M.W., and Song J.G. Study on the photoelectrochemical etching process of semiconducting 6H-SiC wafer. Mater. Sci. Eng. B B95 (2002) 191-194
8. Slikkerveer, P.J., 1999. Mechanical etching of glass by powder blasting, PhD Thesis, Eindhoven University of Technology.
9. Slikkerveer P.J., Bouten P.C.P., in't Veld F.H., and Scholten H. Erosion and damage by sharp particles. Wear 217 (1998) 237-250
10. Slikkerveer P.J., and in't Veld F.H. Model for patterned erosion. Wear 233 235 (1999) 337-386