Thermal resistance and reliability of Low-Cost High-Power LED packages under WHTOL test

2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Volumn , Issue , 2008, Pages 271-276

  Chen, C H ^a   Tsai, W L ^a   Tsai, M Y ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Junction temperature; LED; Reliability; Thermal

Indexed keywords

A THERMALS; ALUMINUM SUBSTRATES; ALUMINUM WIRES; CHIP JUNCTIONS; ENCAPSULANT; EXPERIMENTAL MEASUREMENTS; FINITE-ELEMENT METHODS; FLOW CONDITIONS; FORWARD CURRENTS; GLOBAL WARMING PROBLEMS; HIGH COSTS; HIGH TEMPERATURE OPERATION LIVES; HIGH-POWER; HIGH-POWER LEDS; JUNCTION TEMPERATURE; LED; LOW-COST DESIGNS; LUMINOUS EFFICIENCIES; MOISTURE ABSORPTIONS; RELIABILITY DATUM; STANDARD TESTS; SURFACE TEMPERATURES; TEST CHAMBERS; THERMAL; THERMAL BEHAVIORS; THERMAL COUPLES; THERMAL RESISTANCES;

ALUMINA; ALUMINUM; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; GLOBAL WARMING; HEAT RESISTANCE; HIGH TEMPERATURE OPERATIONS; PACKAGING MATERIALS; PHOSPHORUS; PHYSICAL OPTICS; RELIABILITY; SILICONES; TESTING; WIRE;

LIGHT EMITTING DIODES;

EID: 64049110279     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2008.4784281     Document Type: Conference Paper

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