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Volumn , Issue 32, 2000, Pages 1-6
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Surface tension powered self-assembly of 3D MOEMS devices using DRIE of bonded silicon-on-insulator wafers
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTROSTATIC DRIVES;
MELTABLE PARTS;
MICRO-OPTICAL ELECTRO-MECHANICAL SYSTEMS (MOEMS);
SILICON SUBSTRATES;
ADHESION;
ELECTROSTATICS;
INDUCTIVELY COUPLED PLASMA;
PHOTOLITHOGRAPHY;
PHOTORESISTS;
REACTIVE ION ETCHING;
SELF ASSEMBLY;
SILICON ON INSULATOR TECHNOLOGY;
SURFACE TENSION;
MICROELECTROMECHANICAL DEVICES;
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EID: 6344283088
PISSN: 09633308
EISSN: None
Source Type: Journal
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (8)
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