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Volumn 45, Issue 3, 2004, Pages 769-772
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Chemical mechanical planarization characteristics of ferroelectric film for FRAM applications
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Author keywords
BaSrTiO3 (BST); CMP (chemical mechanical polishing); FRAM; RMS (root mean square); Sol gel; WIWNU (within wafer non uniformity)
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Indexed keywords
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EID: 6344270182
PISSN: 03744884
EISSN: None
Source Type: Journal
DOI: None Document Type: Conference Paper |
Times cited : (18)
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References (11)
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