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Volumn 45, Issue 3, 2004, Pages 769-772

Chemical mechanical planarization characteristics of ferroelectric film for FRAM applications

Author keywords

BaSrTiO3 (BST); CMP (chemical mechanical polishing); FRAM; RMS (root mean square); Sol gel; WIWNU (within wafer non uniformity)

Indexed keywords


EID: 6344270182     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper
Times cited : (18)

References (11)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.