Enhanced diffusivity by triple junction networks

Scripta Materialia

Volumn 52, Issue 1, 2005, Pages 69-73

  Wang, Hongtao ^a   Yang, Wei ^a   Ngan, A H W ^b  

^a TSINGHUA UNIVERSITY   (China)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Diffusion; Electrodeposition; Grain boundary; Nanocrystalline material; Triple junction

Indexed keywords

ANNEALING; DIFFUSION; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; LAPLACE TRANSFORMS; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS;

JUNCTION DIFFUSION; LATTICE DIFFUSION; SEVERE PLASTIC DEFORMATION (SPD); TRIPLE JUNCTION;

NANOSTRUCTURED MATERIALS;

EID: 6344242986     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.08.025     Document Type: Article

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