Low temperature triple junction diffusion in fine scale materials

Materials Science Forum

Volumn 235-238, Issue PART 1, 1997, Pages 469-474

  Peteline, A L ^a  

^a NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY MISIS   (Russian Federation)

Author keywords

Diffusion; Grain boundary; Model; Triple junction

Indexed keywords

CRYSTAL MICROSTRUCTURE; CRYSTALS; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; MATHEMATICAL MODELS;

DIFFUSION COEFFICIENTS; T-JOINT CRYSTAL; TRICRYSTALS; TRIPLE JUNCTION DIFFUSION;

DIFFUSION IN SOLIDS;

EID: 0030871193     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: None     Document Type: Article

References (3)

1. B.S. Bokstein, Ch.V. Kopetsky, L.S. Shvindlerman, Thermodinamics and Kinetics of Grain Boundaries in metalls, Moscow, 1986 (in Russian).
2. V.B. Rabukhin, A.S. Panikarski. Poverchaost' No 5, 150, 1986 (in Russian).
3. J.C. Fisher . J.Appl.Phys. 22,74, 1951.