Brazing of Si3N4 by active Cu-Ga-Ti filler alloys

Journal of Materials Science Letters

Volumn 17, Issue 24, 1998, Pages 2121-2123

  Prokopenko, A A ^a   Zhuravlev, V S ^a   Naidich, Y V ^a  

^a FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING FILLER METALS; COPPER ALLOYS; FRACTURE TESTING; FRACTURE TOUGHNESS; HOT PRESSING; LIQUID METALS; SINTERING; SURFACE ROUGHNESS; THERMAL EFFECTS; THERMAL EXPANSION; WEIBULL DISTRIBUTION; WETTING;

ELECTRON PROBE MICROANALYSIS; SESSILE DROP METHOD;

SILICON NITRIDE;

EID: 0032281516     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1006618324111     Document Type: Article

References (8)

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