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Volumn 40, Issue 5 B, 2001, Pages 3789-3791
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Ultrasonic joining of silicon nitride plates without an adhesive material using a 19 kHz vibration system
a
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Author keywords
Ceramic; Si3N4; Silicon nitride; Ultrasonic joining; Ultrasonic joining using vibration parallel to joining surface
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Indexed keywords
ACOUSTIC TRANSDUCERS;
ADHESIVES;
CERAMIC MATERIALS;
CRACK INITIATION;
HEAT RESISTANCE;
HIGH TEMPERATURE OPERATIONS;
MELTING;
NATURAL FREQUENCIES;
PLATES (STRUCTURAL COMPONENTS);
RESONATORS;
SILICON NITRIDE;
STRENGTH OF MATERIALS;
ULTRASONIC APPLICATIONS;
VIBRATIONS (MECHANICAL);
X RAY ANALYSIS;
ULTRASONIC JOINING;
JOINING;
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EID: 0035327796
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.40.3789 Document Type: Article |
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Times cited : (10)
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References (3)
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