Development of a high performance heat sink based on screen-fin technology

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 53-60

  Li, Chen ^a   Wirtz, R A ^a  

^a University of Nevada   (United States)

Author keywords

Heat sink; Screen laminate

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; HEAT TRANSFER; MATHEMATICAL MODELS; MONTE CARLO METHODS; POROUS MATERIALS; PRANDTL NUMBER; PRESSURE DROP; REYNOLDS NUMBER; THERMAL CONDUCTIVITY; CHIP SCALE PACKAGES; COOLING; COOLING SYSTEMS; COSTS; DROPS; ELECTRONIC COOLING; ELECTRONICS PACKAGING; FINS (HEAT EXCHANGE); FLEXIBLE MANUFACTURING SYSTEMS; FRICTION; HEAT EXCHANGERS; LAMINATES; MANUFACTURE; THERMAL VARIABLES MEASUREMENT;

HEAT EXCHANGER PRESSURE DROP; SCREEN-FIN TECHNOLOGY; SCREEN-LAMINATE;

FINS (HEAT EXCHANGE); HEAT SINKS;

CORRELATION EQUATION; DIVERGENCE HALF ANGLES; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; HEAT TRANSFER PERFORMANCE; PROTOTYPES; SEMI-EMPIRICAL MODELING; THERMAL FACTORS; THERMAL PERFORMANCE;

EID: 0037277870     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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