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Volumn 16, Issue 8, 2009, Pages 221-225
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Integration of Compound Semiconductor Devices and CMOS (CoSMOS) with die to wafer bonding
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
BIPOLAR SEMICONDUCTOR DEVICES;
CMOS INTEGRATED CIRCUITS;
EPITAXIAL GROWTH;
III-V SEMICONDUCTORS;
INDIUM PHOSPHIDE;
INTEGRATION;
SEMICONDUCTING INDIUM PHOSPHIDE;
SILICON COMPOUNDS;
SILICON WAFERS;
SUBSTRATES;
TRANSISTORS;
ADHESIVE BONDING TECHNIQUES;
COMPOUND SEMICONDUCTORS;
GROWTH ORIENTATIONS;
SCALE INTEGRATION;
SILICON SUBSTRATES;
SILICON-BASED TRANSISTORS;
TARGET-SUBSTRATE;
WAFER BONDING PROCESS;
WAFER BONDING;
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EID: 63149198910
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.2982872 Document Type: Conference Paper |
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Times cited : (5)
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References (9)
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