Al to Al wafer bonding for MEMS encapsulation and 3-D interconnect

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 810-813

  Yun, C H ^a   Martin, J R ^a   Tarvin, E B ^a   Winbigler, J T ^a  

^a ANALOG DEVICES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPOSITE MICROMECHANICS; COPPER; ENCAPSULATION; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SILICON; SILICON WAFERS; THREE DIMENSIONAL;

BOND PADS; HERMETIC SEALING; HERMETICITY; INPUT/OUTPUT; INTERNATIONAL CONFERENCES; MEMS DEVICES; MICRO-ELECTRO MECHANICAL SYSTEMS; POLYCRYSTALLINE-SI; SEAL RINGS;

WAFER BONDING;

EID: 47249125974     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443780     Document Type: Conference Paper

References (6)

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2. L. E. Felton, M. Duffy, N. Hablutzel, P. W. Farrell, and W. A. Webster, "Low-cost packaging of inertial MEMS devices," in Proc. 36th Int. Symp. Microelectronics, Boston, MA, 18-20 Nov. 2003, pp. 402-406.
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5. MIL-STD-883E Method 2019.7, "Die shear strength," 2003.
6. MIL-STD-750E Method 1071.8, "Hermetic seal," 2007.