MEMS wafer-level packaging with conductive vias and wafer bonding

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 2091-2094

  Yun, C H ^a   Martin, J R ^a   Chen, T ^a   Davis, D ^a  

^a ANALOG DEVICES INC   (United States)

Author keywords

Thermo compression bonding; Through wafer via; Wafer level package

Indexed keywords

ACCELEROMETERS; ACTUATORS; ALUMINUM; BRAZING; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; MEMS; METALS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NONMETALS; SENSORS; SILICON; SILICON WAFERS; SPUTTER DEPOSITION; SPUTTERING; TRANSDUCERS; WELDING;

BOND PADS; GLASS FRITS; INTERNATIONAL CONFERENCES; MICRO-MACHINED ACCELEROMETERS; PACKAGED DEVICES; POLY-CRYSTALLINE SILICON; PRODUCTION ACCELEROMETERS; SOLID-STATE SENSORS; THERMO-COMPRESSION BONDING; THREE-AXIS; THROUGH HOLES; THROUGH WAFER VIA; VIA-FIRST; WAFER LEVEL PACKAGE; WAFER LEVELS; WAFER-LEVEL PACKAGING;

WAFER BONDING;

EID: 47249110047     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300577     Document Type: Conference Paper

References (1)

1. C. H. Yun, T. J. Brosnihan, W. A. Webster, and J. Villarreal, "Wafer-level packaging of MEMS accelerometers with through-wafer interconnects", in The 55th Electronic Components and Technology Conferences Proceedings, Lake Buena Vista, FL, 31 May - 3 June 2005, pp. 320-323.