Optimal design of Al/Si bimorph electro-thermal microactuator by integrating finite-element code with optimization method

Sensors and Actuators, A: Physical

Volumn 151, Issue 1, 2009, Pages 53-63

  Cheng, Chin Hsiang ^a   Chan, Chi Kang ^b   Lai, Guang Jer ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b TATUNG UNIVERSITY   (Taiwan)

Author keywords

Al Si bimorph; Electro thermal effect; Microactuator; Optimization

Indexed keywords

ALUMINA; ALUMINUM; CANTILEVER BEAMS; COMPUTER SIMULATION; CONJUGATE GRADIENT METHOD; DESIGN; MICROACTUATORS; THERMAL EFFECTS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

AL/SI BIMORPH; CONJUGATE-GRADIENT METHODS; CONVENTIONAL DESIGNS; DESIGN MODELS; DEVICE PERFORMANCE; ELECTRO-THERMAL EFFECT; ELECTRO-THERMAL MICROACTUATORS; FINITE ELEMENTS; FINITE-ELEMENT CODES; GEOMETRICAL PARAMETERS; HIGH TEMPERATURES; INITIAL GUESS; ITERATIVE OPTIMIZATIONS; MATERIAL LAYERS; MICROACTUATOR; MULTI-PHYSICS CODES; NUMERICAL SIMULATIONS; OPTIMAL COMBINATIONS; OPTIMAL DESIGNS; OPTIMIZATION APPROACHES; OPTIMIZATION METHODS; OPTIMIZATION PROCESS; OXIDIZATION; P-TYPE SILICONS; PARAMETRIC STUDIES; POWER CONSUMPTION; PROBLEM SOLVERS; TEST CASE; THERMAL FIELDS;

OPTIMIZATION;

EID: 63049132130     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.01.013     Document Type: Article

References (14)

1. Zhange Y.W., Zhang Y.X., and Marcus R.B. Thermally actuated microprobes for a new wafer probe card,. J. Microelectromech. Syst. 8 (1999) 43-49
2. Luo J.K., Flewitt A.J., Spearing S.M., Fleck N.A., and Milne W.I. Three types of planar structure microspring electro-thermal actuators with insulating beam constraints. J. Micromech. Microeng. 15 (2005) 1527-1535
3. Chan C.K., Cheng C.H., and Cheng T.C. Analysis and design of an electro-thermal microactuator. Proceedings of the Symposium on Nano Device Technology 2004. Hsinchu, Taiwan, May 12-13 (2004)
4. Timoshenko S. Analysis of bi-metal thermostats. J. Opt. Soc. Am. 11 (1925) 233
5. Judy M.W., and Howe R.T. Polysilicon hollow beam lateral resonators. Proceedings of IEEE Micro Electro Mechanical Systems (1993) 265-271
6. Guckel H., Klein J., Christenson T., Skrobis K., Laudon M., and Lovell E.G. Thermo-magnetic metal flexure actuators. Proceedings of the 1992 IEEE Solid-State Sensor and Actuator Workshop. Hilton Head, SC (June 1992) 73-75
7. Comtois J.H., Michalicek M.A., and Barron C.C. Characterization of electrothermal actuators and arrays fabricated in a four-level, planarized surface-micromachined polycrystalline silicon process. Proceedings of the 1997 International Conference on Solid-State Sensors and Actuators, vol. 2. Chicago, IL (June 1997) 769-772
8. Riethmuller W., and Benecke W. Thermally excited silicon microactuators. IEEE Trans. Electron Devices 35 June (1988) 758-763
9. Benecke W., and Riethmuller W. Applications of silicon microactuators based on bimorph structures. Micro Electro Mechanical Systems, 1989, Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (February 1989), IEEE 116-120
10. Seki T., Sakata M., Nakajima T., and Matsumoto M. Thermal buckling actuator for micro relays. Proceedings of 1997 International Conference on Solid-State Sensors and Actuators (Transducer '97). Chicago, IL (June 1997) 1153-1156
11. Cheng C.H., Chan C.K., Cheng T.C., Hsu C.W., and Lai G.J. Modeling, fabrication and performance test of an electro-thermal microactuator. Sens. Actuators A: Phys. 143 (2008) 360-369
12. Cheng C.H., and Chang M.H. A simplified conjugate-gradient method for shape identification based on thermal data. Numer. Heat Transf., Part B 43 (2003) 489-507
13. ANSYS Inc., Theory Reference of ANSYS Release 10.0 Structures with geometric nonlinearities, Chap. 3, August 2005.
14. Beadle W.E., Tsai J.C., and Plummer R.D. Quick Reference Manual for Silicon Integrated Circuit Technology (1985), Wiley, New York