Development on wafer level anisotropic conductive film for flip-chip interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 155-158

  Souriau, Jean Charles ^a   Brun, Jean ^a   Franiatte, Rémi ^a   Gasse, Adrien ^a  

^a CEA GRENOBLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; INTEGRATED CIRCUITS; INTERCONNECTION NETWORKS; MICROELECTRONICS; MULTIMEDIA SYSTEMS; SILICON WAFERS;

FLIP-CHIP INTERACONNECTION; MICRO-BALLS; WAFER LEVEL PACKAGING (WLP);

FLIP CHIP DEVICES;

EID: 10444235050     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. D S. Patterson et al. "Some fundamentals of wafer-level packaging" Solid State Technology 2002. pp 105-113.
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5. st Electronic Components and Technology Conf, 2001
6. P. Caillat et al. "Ultra fine pitch vertical interconnection sheet: an alternative to fusible bum Flip-Chip technology in dense interconnection application" Advances in Electronic Packaging -1997, vol.1, pp 319-322
7. J-C. Souriau et al "Electrical Conductive Adhesive for Flip-Chip Interconnection based on Z-axis conductors", IMAPS 13th European Microelectronics and Packaging Conference and Exhibition, May 30th, 31st and June 1st 2001, pp. 20-22.
8. nd Electronic Components and Technology Conf, New Orleans,L, May. 2002, pp. 1151-1153.
9. C. Rossat et al "Assessment of advanced Anisotropic Conductive Films for Flip-Chip Interconnection based on Z axis conductors", IMAPS 14th European Microelectronics and Packaging Conference and Exhibition, June 23rd-25th 2003, Friedrischshafen, Germany, pp. 179-183.
10. A.Gasse et al "Assessment of advanced Anisotropic Conductive Films for Flip-Chip Interconnection based on Z axis conductors", Nuclear Science Symposium - Medical Imaging Conference, Portland, Oregon, USA October 19-25, 2003