Wafer-applied underfill: Flip-chip assembly and reliability

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 2, 2004, Pages 101-108

  Johnson, R Wayne ^a   Wang, Qing ^a   Ding, Fei ^a   Hou, Zhenwei ^a   Crane, Larry ^b   Tang, Hao ^b   Shi, Gary ^b   Zhao, Renzhe ^b   Danvir, Jan ^c   Qi, Jing ^c  

^a AUBURN UNIVERSITY   (United States)

^b Henkel Loctite Corp   (United States)

^c MOTOROLA INC   (United States)

Author keywords

Flip chip; Preapplied; Underfill; Wafer applied

Indexed keywords

COATINGS; CONSUMER ELECTRONICS; FAILURE ANALYSIS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY; SEMICONDUCTING ORGANIC COMPOUNDS; SHOCK TESTING; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

FLIP CHIP ASSEMBLY; FLIP CHIP RELIABILITY; ORGANIC SUBSTRATE; WAFER APPLIED UNDERFILL; WAFER BUMPING; WAFER SAWING;

CHIP SCALE PACKAGES;

EID: 19944426124     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.839599     Document Type: Article

References (12)

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