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Volumn 60, Issue 11, 2009, Pages 957-959

The effect of annealing and chemical mechanical polishing on Ge2Sb2Te5 phase change memory

Author keywords

Anneal; Chemical mechanical polishing (CMP); Ge2Sb2Te5; Phase change memory (PCM)

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DURABILITY; GERMANIUM; NANOTECHNOLOGY; PHASE CHANGE MEMORY; POLISHING; PULSE CODE MODULATION; TELLURIUM COMPOUNDS;

EID: 62849126863     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2009.02.023     Document Type: Article
Times cited : (6)

References (16)
  • 12
    • 0141538290 scopus 로고    scopus 로고
    • Y.H. Ha, J.H. Yi, H. Horii, J.H. Park, S.H. Joo, S.O. Park, J.T. U-In Chung Moon, An edge contact type cell for Phase Change RAM featuring very low power consumption, in: VLSI Technology, 2003. Digest of Technical Papers, Memory Div., Samsung Electron. Co. Ltd., Kyungki, South Korea, 2003, pp. 175.
    • Y.H. Ha, J.H. Yi, H. Horii, J.H. Park, S.H. Joo, S.O. Park, J.T. U-In Chung Moon, An edge contact type cell for Phase Change RAM featuring very low power consumption, in: VLSI Technology, 2003. Digest of Technical Papers, Memory Div., Samsung Electron. Co. Ltd., Kyungki, South Korea, 2003, pp. 175.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.