Optimized inspection of advanced reticles on the teraScan reticle inspection tool

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5992, Issue 2, 2005, Pages

  Dayal, Aditya ^a   Sier, J P ^a   Sousa, Weston ^a   Labovitz, Steven ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

Defect; DUV; Inspection; Lithography; OPC; Photomask; Reticle

Indexed keywords

DUV; OPC; PHOTOMASKS; RETICLE;

ALGORITHMS; INSPECTION; LIGHT TRANSMISSION; OPTICAL RESOLVING POWER; OPTIMIZATION; PHOTOLITHOGRAPHY;

MASKS;

EID: 33644608030     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.634078     Document Type: Conference Paper

References (6)

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2. rd Annual BACUS symposium on Photomask Technology, Proc. SPIE Vol. 5256 (2003), pp. 474-488.
3. Dayal, A., Bergman, N. & Sanchez, P., "Implementation of High resolution Reticle Inspection in Wafer Fabs", Proc. SPIE Vol 5038 (2003), pp 1153-1160.
4. th Annual BACUS symposium on Photomask Technology, Proc SPIE Vol. 3873 (1999)
5. Eynon, B. G. Jr in Photomask Fabrication Technology, Eds: Benjamin Eynon and Banqui Wu, McGraw Hill, Chapter 1, (2005)
6. Zurbrick, L., "An Analysis of In-Process Pattern Inspection Benefit to Cost Relationship", Photomask and NGL Mask Technology XI, Proc SPIE Vol. 5446 (2004)