Hermetic fiber pigtailed laser module utilizing passive device alignment on an LTCC substrate

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 1, 2009, Pages 223-227

  Keranen, Kimmo ^a   Ollila, Jyrki ^a   Makinen, Jukka Tapini ^a   Korhonen, Pentti ^a   Kautio, Kari T ^a   Heikkinen, Veli ^a   Karioja, Pentti ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Cost of ownership; Hermetic laser module; Hybrid integration; Low temperature cofired ceramics (LTCC); Passive alignment

Indexed keywords

ALIGNMENT; BANDPASS FILTERS; CERAMIC MATERIALS; FIBERS; GLASS; HELIUM; INTERNET PROTOCOLS; LASERS; METALS; MULTIMODE FIBERS; RUBBER; SUBSTRATES; THREE DIMENSIONAL;

COST-OF-OWNERSHIP; HERMETIC LASER MODULE; HYBRID INTEGRATION; LOW-TEMPERATURE COFIRED CERAMICS (LTCC); PASSIVE ALIGNMENT;

PULSED LASER APPLICATIONS;

EID: 61649097004     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.2007130     Document Type: Article

References (11)

1. R. Lestra and J.-Y. Emery, "Monolithic integration of spot-size converters with 1.3 μm lasers and 1.55 μm polarization insensitive semi-conductor optical amplifiers," IEEE J. Sel. Topics Quantum Electron., vol. 3, pp. 1429-1440, Dec. 1997.
2. H. Cho, K.-M. Chu, S. Kang, S. Hwang, B. Rho, W. Kim, J.-S. Kim, J.-J. Kim, and H.-H. Park, "Compact packaging of optical and electronic components for on-board optical interconnections," IEEE Trans. Adv. Packag., vol. 28, no. 1, pp. 114-120, Feb. 2005.
3. D. Bartelink, "Integrated systems," IEEE Trans. Electron Devices vol. 43, no. 10, pp. 1678-1687, Oct. 1996.
4. M. Aoki, M. Komori, H. Sato, T. Tsuchiya, A. Taike, M. Takahashi, K. Uomi, and S. Tsuji, "Reliable wide-temperature-range operation of 1.3 μm beam-expander integrated laser diode for passively aligned optical modules," IEEE J. Sel. Topics Quantum Electron, vol. 3, pp. 1405-1412, Dec. 1997.
5. E. Towe, "Heterogeneous optoelectronic integration," in Proc. SPIE 2000, pp. 1-6.
6. K. Keränen, J.-T. Mäkinen, K. Kautio, J. Ollila, J. Petäjä, V. Heikkinen, J. Heilala, and P. Karioja, "Fiber pigtailed multi-mode laser module based on passive alignment of devices using an LTCC substrate," IEEE Trans. Adv. Packag., vol. 29, no. 3, pp. 463-472, Aug. 2006.
7. S. Ragona, "Cost of ownership for optoelectronic manufacturing equipment," Global SMT Packag., vol. 2, pp. 20-24, Aug. 2002.
8. T. Sakai, S. Okamoto, T. Iikawa, T. Sato, and Z. Henmi, "A new laser hermetic sealing technique for aluminium package," IEEE Trans. Comp., Packag., Manufact. Tech., vol. 10, no. 3, pp. 433-436, Sep. 1987.
9. J. Ollila, K. Kautio, J. Vähäkangas, T. Hannula, H. Kopola, J. Oikarinen, and M. Sivonen, "Hermetic diode laser transmitter module," in Proc. SPIE, 1999, vol. 3626, pp. 123-126.
10. D. Schleuning, R. Dato, G. Frangineas, M. Jansen, C. King, R. Nabiev, and C. Nabors, "Packaging multiple active and passive elements in a hybrid optical platform," J. Lightwave Technol., vol. 22, pp. 1320-1326, May 2004.
11. J. Newman, "Optical leak testing of hermetic packages," in Proc. SPIE, 2001, vol. 4587, pp. 645-650.