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Volumn 18, Issue 4, 2005, Pages 528-533

Fault detection for a via etch process using adaptive multivariate methods

Author keywords

Fault detection; Hotelling T 2; Knowledge based methods; Plasma etching

Indexed keywords

COVARIANCE MATRIX; FAULT DETECTION; KNOWLEDGE-BASED METHODS;

EID: 28644433961     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2005.858495     Document Type: Conference Paper
Times cited : (37)

References (12)
  • 2
    • 0001863578 scopus 로고    scopus 로고
    • Development and benchmarking of multivariate statistical process control tools for a semiconductor etch process: Improving robustness through model updating
    • Banff, Canada, Jun.
    • N. B. Gallagher, B. Wise, S. Butler, D. White, and G. Barna, "Development and benchmarking of multivariate statistical process control tools for a semiconductor etch process: Improving robustness through model updating," in Proc. IFAC Int. Symp. Advanced Control Chemical Processes (ADCHEM'97), Banff, Canada, Jun. 1997.
    • (1997) Proc. IFAC Int. Symp. Advanced Control Chemical Processes (ADCHEM'97)
    • Gallagher, N.B.1    Wise, B.2    Butler, S.3    White, D.4    Barna, G.5
  • 3
    • 0029267381 scopus 로고
    • Statistical process control of multivariate processes
    • J. F. MacGregor and T. Kourti, "Statistical process control of multivariate processes," Control Eng. Pract., vol. 3, pp. 403-414, 1995.
    • (1995) Control Eng. Pract. , vol.3 , pp. 403-414
    • MacGregor, J.F.1    Kourti, T.2
  • 5
    • 0029252734 scopus 로고
    • Statistical process control of multivariate processes
    • P. Nomikos and J. F. MacGregor, "Statistical process control of multivariate processes," Technometr., vol. 37, pp. 41-59, 1995.
    • (1995) Technometr. , vol.37 , pp. 41-59
    • Nomikos, P.1    MacGregor, J.F.2
  • 7
    • 28644447007 scopus 로고    scopus 로고
    • Diagnostics of plasma etch: PCA with adaptive centering and scaling
    • Colorado Springs, CO, Sep.
    • K. A. Chamness and T. Edgar, "Diagnostics of plasma etch: PCA with adaptive centering and scaling," in Proc. AEC/APC Symp. XV, Colorado Springs, CO, Sep. 2003.
    • (2003) Proc. AEC/APC Symp. XV
    • Chamness, K.A.1    Edgar, T.2
  • 9
    • 28644442178 scopus 로고    scopus 로고
    • In situ real time monitoring of a via etch process
    • Colorado Springs, CO, Sep.
    • G. Spitzlsperger, C. Schmidt, and J. Strasser, "In situ real time monitoring of a via etch process," in Proc. AEC/APC Symp. XV, Colorado Springs, CO, Sep. 2003.
    • (2003) Proc. AEC/APC Symp. XV
    • Spitzlsperger, G.1    Schmidt, C.2    Strasser, J.3
  • 12


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.