Shear strength development of the phenol-formaldehyde adhesive bond during cure

Wood Science and Technology

Volumn 43, Issue 1-2, 2009, Pages 153-166

  Jost, Matej ^a   Sernek, Milan ^a  

^a UNIVERSITY OF LJUBLJANA   (Slovenia)

Author keywords

[No Author keywords available]

Indexed keywords

BOND (MASONRY); DATA ENVELOPMENT ANALYSIS; FORMALDEHYDE; HOT PRESSING; PHENOLS; SHEAR STRENGTH;

ADHESIVE BONDS; BEECH (FAGUS SYLVATICA L.); CHEMICAL CONVERSIONS; CONDUCTIVITY DATUM; CURING PROCESS; DEGREE OF CURES; DIELECTRIC ANALYSIS; EVALUATION SYSTEMS; LAP-SHEAR SPECIMENS; LAST STAGES; MECHANICAL ASPECTS; PHENOL FORMALDEHYDES; PHENOL-FORMALDEHYDE ADHESIVES; PRESSING TEMPERATURES; PRESSING TIME; STRENGTH DEVELOPMENT;

CURING;

FAGUS; FAGUS SYLVATICA; SECALE CEREALE;

EID: 60649095644     PISSN: 00437719     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00226-008-0217-2     Document Type: Article

References (20)

1. MJA Chowdhury PE Humphrey 1999 The effect of acetylation on the shear strength development kinetics of phenolic resin-to-wood bonds Wood Fiber Sci 31 293 299
2. AW Christiansen RA Follensbee RL Geimer JA Koutsky GE Myers 1993 Phenol-formaldehyde resin curing and bonding in steam-injection pressing. Part II. Differences between rates of chemical and mechanical responses to resin cure Holzforschung 47 76 82
3. M Dunky 2004 Adhesives based on formaldehyde condensation resins Macromol Symp 217 417 430
4. EN 827 (2005) Adhesives-determination of conventional solids content and constant mass solids content:8 p
5. Heinemann C, Fruhwald A, Humphrey PE (2002a) Evaluation of adhesive cure during hot pressing of wood-based composites. COST E13, Workshop Proceedings, 3rd Workshop, Vienna, 19-20 September 2002, pp 1-8
6. Heinemann C, Lehnen R, Humphrey PE (2002b) Kinetic response of thermosetting adhesive systems to heat: physico-chemical versus mechanical responses. Proceedings of the 6th Pacific Rim Bio-Based composites symposium. Portland/USA, 10-13 November 2002, Corvallis, Oregon state university, pp 34-44
7. Humphrey PE (1990) Device for testing adhesive bonds. United States Patent 5.176.028
8. Humphrey PE (2006) Temperature and reactant injection effects on the bonding kinetics of thermosetting adhesives. In: Frihart CR Wood adhesives 2005. Forest Products Society, Madison, pp 311-316
9. Kim JW, Humphrey PE (2000) The effect of testing temperature on the strength of partially cured phenol-formaldehyde adhesive bonds. Wood adhesives 2000: extended abstracts: 22-23 June 2000. Forest Product Society, South Lake Tahoe, pp 92-94
10. B Kreber PE Humphrey JJ Morrell 1993 Effect of polyborate pre-treatment on the shear strength development of phenolic resin to Sitka spruce bonds Holzforschung 47 398 402
11. M Lecourt A Pizzi P Humphrey 2003 Comparison of TMA and ABES as forecasting systems of wood bonding effectiveness Holz Roh- Werkst 61 75 76
12. Lodeiro MJ, Mulligan DR (2005) Good practice guide to cure monitoring. Measurement good practice guide No 75. National Physical Laboratory, Teddington, Middlesex, UK, TW11 0LW, pp 17-32
13. Luukko PB, Nystrom M, Rainio J (2000) Comparing the use of different foaming agents in making phenol-formaldehyde plywood glue. Wood adhesives 2000: extended abstracts: 22-23 June 2000. Forest Product Society, South Lake Tahoe, pp 96-98
14. TRN Prasad PE Humphrey JJ Morrell 1994 The effects of chromated copper arsenate and ammoniacal copper zinc arsenate on shear strength development of phenolic resin to Sitka spruce bonds Wood Fiber Sci 26 223 228
15. Seber GAF, Wild CJ (1989) Growth models. In: Nonlinear regression. Wiley, New York, pp 325-365
16. M Sernek FA Kamke 2007 Application of dielectric analysis for monitoring the cure process of phenol formaldehyde adhesive Int J Adh Adhes 27 562 567
17. Sernek M, Kokalj A, Jost M (2006) The development of adhesive bond strength during phenol-formaldehyde resin curing. Wood resources and panel properties: conference proceedings: Cost Action E44-E49, Valencia, Spain, 12-13 June 2006. Valencia: AIDIMA, Furniture, wood and packaging technology institute, pp 89-96
18. PR Steiner SR Warren 1981 Rheology of wood-adhesive cure by torsional braid analysis Holzforschung 35 273 278
19. SK Waage DJ Gardner TJ Elder 1991 The effects of fillers and extenders on the cure properties of phenol-formaldehyde resin as determined by the application of thermal techniques J Appl Polym Sci 42 273 278
20. SQ Wang PM Winistorfer 2003 Monitoring resin cure during particleboard manufacture using a dielectric system Wood Fiber Sci 35 532 539