Monitoring resin cure during particleboard manufacture using a dielectric system

Wood and Fiber Science

Volumn 35, Issue 4, 2003, Pages 532-539

  Wang, Siqun ^a   Winistorfer, Paul M ^b  

^a UNIVERSITY OF TENNESSEE   (United States)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Density; Dielectric; Impedance; Particleboard; Pressing; Resin cure; UF

Indexed keywords

BONDING; HOT PRESSING; PARTICLE BOARD; RESINS; STRUCTURAL PANELS;

DIELECTRIC SYSTEMS;

CURING;

BONDING; CURING; HOT PRESSING; PANELS; PARTICLE BOARDS; ROSIN;

EID: 0242667130     PISSN: 07356161     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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