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Volumn 61, Issue 1, 2003, Pages 75-76

Comparison of TMA and ABES as forecasting systems of wood bonding effectiveness

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; ELASTIC MODULI; FORMALDEHYDE; HARDENING; MATERIALS TESTING; TEMPERATURE; TENSILE STRENGTH;

EID: 0037295029     PISSN: 00183768     EISSN: None     Source Type: Trade Journal    
DOI: 10.1007/s00107-002-0346-5     Document Type: Article
Times cited : (32)

References (5)
  • 3
    • 0012346599 scopus 로고
    • US patent USP 5 176 028
    • Humphrey PE (1990) US patent USP 5 176 028
    • (1990)
    • Humphrey, P.E.1
  • 4
    • 26344464013 scopus 로고    scopus 로고
    • Etude de la cinetique du durcissement "in situ" sur le bois de colles a base de tannin
    • ENSTIB 3 year research report, Epinal, France
    • Lecourt M (2001) Etude de la cinetique du durcissement "in situ" sur le bois de colles a base de tannin. ENSTIB 3 year research report, Epinal, France, pp. 39
    • (2001) , pp. 39
    • Lecourt, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.