Method for quantifying the degree of agglomeration in highly stable chemical mechanical polishing slurries

Electrochemical and Solid-State Letters

Volumn 12, Issue 4, 2009, Pages

  Chang, Feng Chi ^a   Singh, Rajiv K ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; CHEMICAL MECHANICAL POLISHING; CHEMICAL STABILITY; NANOTECHNOLOGY; POLISHING; PROGRAMMING THEORY; SLURRIES; ZETA POTENTIAL;

AGGREGATION THEORIES; CMP SLURRIES; DEGREE OF AGGLOMERATIONS; INTER-PARTICLE FORCES; MECHANICAL POLISHING; PARTICLE AGGLOMERATIONS; SHEAR FORCES; SLURRY CHEMISTRIES; SLURRY STABILITIES; TAIL DISTRIBUTIONS; ZETA POTENTIAL MEASUREMENTS;

CHEMICAL POLISHING;

EID: 60449110568     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3074306     Document Type: Article

References (11)

1. G. B. Basim and B. M. Moudgil, J. Colloid Interface Sci., 256, 137 (2002).
2. F. C. Chang, S. Tanawade, and R. Singh, IEEE Trans. Syst. Sci. Cybern., 31, 46 (2008).
3. G. B. Basim, I. U. Vakarelski, and B. M. Moudgil, J. Colloid Interface Sci., 263, 506 (2003).
4. T. Gopal and J. B. Talbot, J. Electrochem. Soc., 153, G622 (2006).
5. G. Vidrich, J.-F. Castagnet, and H. Ferkelz, J. Electrochem. Soc., 152, C294 (2005).
6. D.-H. Eom, J.-G. Park, and E.-S. Lee, Jpn. J. Appl. Phys., Part 1, 41, 1305 (2002).
7. K. Nicholes, R. K. Singh, D. Grant, and M. R. Litchy, Semicond. Int., 24, 201 (2001).
8. F.-C. Chang, S. Tanawade, and R. K. Singh, J. Electrochem. Soc., 156, H39 (2009).
9. M. Elimelech, J. Gregory, X. Jia, and R. A. Williams, Particle Deposition and Aggregation, Butterworth-Heinemann, Oxford (1998).
10. W. B. Russel, D. A. Saville, and W. R. Schowalter, Colloidal Dispersions, Cambridge University Press, Cambridge (1989).
11. H. Stechemesser and B. Dobiáš, Coagulation and Flocculation, Taylor & Francis, Boca Raton, FL (2005).