Measuring particles in CMP slurries

Semiconductor International

Volumn 24, Issue 8, 2001, Pages 201-202+204+206

  Nicholes, K ^a   Singh, R ^a   Grant, D ^a   Litchy, M ^a  

^a BOC Edwards   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTOELECTRIC EFFECTS; CHEMICAL MECHANICAL POLISHING; LIGHT EXTINCTION; LIGHT SCATTERING; PARTICLE SIZE ANALYSIS; PUMPS; QUALITY CONTROL; REGRESSION ANALYSIS; SENSORS; SILICA; SLURRIES;

CHEMICAL MECHANICAL POLISHING SLURRIES; COMPRESSED DRY AIR;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0035391868     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Parameters for monitoring CMP slurry stability and contamination
2. Comparison of vacuum-pressure vs. pump dispense engines for CMP slurry distribution
3. Perturbation detection analysis: A method for comparing instruments that measure CMP slurry health
4. Automatic, high-resolution particle size analysis by single-particle optical sensing