Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution

Electrochimica Acta

Volumn 54, Issue 8, 2009, Pages 2197-2202

  Fukami, Kazuhiro ^a   Tanaka, Yuki ^a   Chourou, Mohamed L ^a   Sakka, Tetsuo ^a   Ogata, Yukio H ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Copper; Electrodeposition; Mesopore; Porous silicon; Template

Indexed keywords

COPPER; DOPING (ADDITIVES); POROUS SILICON;

ABSOLUTE VALUES; AQUEOUS SOLUTIONS; CONSTANT CURRENT DENSITIES; COPPER ELECTRODEPOSITIONS; DIFFUSION LIMITEDS; ELECTRODEPOSITION CURRENTS; FILLING BEHAVIORS; MESO-PORES; MESO-POROUS SILICONS; MESOPORE; NUMERICAL SIMULATIONS; P-TYPE SILICONS; PLANAR ELECTRODES; SIMPLE MODELS; TEMPLATE;

ELECTRODEPOSITION;

EID: 59849093789     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.10.024     Document Type: Article

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