Investigation of carbon nanotube growth on multimetal layers for advanced interconnect applications in microelectronic devices

Journal of the Electrochemical Society

Volumn 156, Issue 3, 2009, Pages

  Lin, Nay ^a   Wang, Huili ^a   Dixit, Pradeep ^b   Xu, Ting ^a   Zhang, Sam ^a   Miao, Jianmin ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; ALUMINUM NITRIDE; ATOMIC SPECTROSCOPY; BUFFER LAYERS; CATALYSIS; COPPER; GROWTH (MATERIALS); HYDROGEN; NANOCOMPOSITES; NANOTUBES; NITRIDES; PHOTOELECTRON SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; TANTALUM; TIN; TITANIUM; TITANIUM COMPOUNDS; TITANIUM NITRIDE; TRANSITION METALS; X RAY PHOTOELECTRON SPECTROSCOPY;

ALUMINUM OXIDE PARTICLES; ANNEALING PROCESS; ATOMIC-FORCE MICROSCOPIES; CARBON NANOTUBE GROWTHS; CATALYST LAYERS; CATALYST NANOPARTICLES; CHAMBER PRESSURES; CONDUCTIVE LAYERS; HYDROGEN FLOWS; INTERCONNECT APPLICATIONS; IRON FILMS; MICRO-ELECTRONIC DEVICES; MULTI METALS; ROOM TEMPERATURES; SCANNING ELECTRON MICROSCOPES; SPUTTERING PROCESS; X-RAY PHOTOELECTRON SPECTROSCOPIES; XPS;

CARBON NANOTUBES;

EID: 59749091558     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3060347     Document Type: Article

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