-
1
-
-
0000730481
-
-
P. C. Hidber, W. Helbig, E. Kim, and G. M. Whitesides, Langmuir, 12, 1375 (1996).
-
(1996)
Langmuir
, vol.12
, pp. 1375
-
-
Hidber, P.C.1
Helbig, W.2
Kim, E.3
Whitesides, G.M.4
-
3
-
-
44649194645
-
-
D. O. Kim, W. I. Shon, J. M. Jin, and S. H. Oh, Polymer (Korea), 31, 410 (2007).
-
(2007)
Polymer (Korea)
, vol.31
, pp. 410
-
-
Kim, D.O.1
Shon, W.I.2
Jin, J.M.3
Oh, S.H.4
-
4
-
-
44649088454
-
-
D. O. Kim, W. I. Shon, J. M. Jin, and S. H. Oh, Polymer (Korea), 31, 184 (2007).
-
(2007)
Polymer (Korea)
, vol.31
, pp. 184
-
-
Kim, D.O.1
Shon, W.I.2
Jin, J.M.3
Oh, S.H.4
-
6
-
-
0344614440
-
-
Z. Hou, S. Dante, N. L. Abbott, and P. Stroeve, Langmuir, 15, 3011 (1999).
-
(1999)
Langmuir
, vol.15
, pp. 3011
-
-
Hou, Z.1
Dante, S.2
Abbott, N.L.3
Stroeve, P.4
-
7
-
-
0035815049
-
-
S. Meltzer, R. Resch, B. E. Koel, M. E. Thompson, A. Madhukar, A. A. G. Requicha, and P. Will, Langmuir, 17, 1713 (2001).
-
(2001)
Langmuir
, vol.17
, pp. 1713
-
-
Meltzer, S.1
Resch, R.2
Koel, B.E.3
Thompson, M.E.4
Madhukar, A.5
Requicha, A.A.G.6
Will, P.7
-
9
-
-
0026962357
-
-
A. M. T. van de Putten, J. W. G de Bakker, and L. G. J. Fokkink, J. Electrochem. Soc., 139, 3475 (1992).
-
(1992)
J. Electrochem. Soc
, vol.139
, pp. 3475
-
-
van de Putten, A.M.T.1
de Bakker, J.W.G.2
Fokkink, L.G.J.3
-
11
-
-
0038680731
-
-
S. Hrapovic, Y. Liu, G. Enright, F. Bensebaa, and J. H. T. Luong, Langmuir, 19, 3958 (2003).
-
(2003)
Langmuir
, vol.19
, pp. 3958
-
-
Hrapovic, S.1
Liu, Y.2
Enright, G.3
Bensebaa, F.4
Luong, J.H.T.5
-
12
-
-
0037018435
-
-
D. I. Gittins, A. S. Susha, B. Schoeler, and F. Caruso, Adv. Mater., 14, 508 (2002).
-
(2002)
Adv. Mater
, vol.14
, pp. 508
-
-
Gittins, D.I.1
Susha, A.S.2
Schoeler, B.3
Caruso, F.4
-
14
-
-
34047219342
-
-
B. H. Jun, J. H. Kim, H. Park, J. S. Kim, K. N. Yu, S. M. Lee, H. Choi, S. Y. Kwak, Y. K. Kim, D. H. Jeong, M. J. Cho, and Y. S. Lee, J. Comb. Chem., 9, 237 (2007).
-
(2007)
J. Comb. Chem
, vol.9
, pp. 237
-
-
Jun, B.H.1
Kim, J.H.2
Park, H.3
Kim, J.S.4
Yu, K.N.5
Lee, S.M.6
Choi, H.7
Kwak, S.Y.8
Kim, Y.K.9
Jeong, D.H.10
Cho, M.J.11
Lee, Y.S.12
-
15
-
-
0035796948
-
-
G. H. Yang, E. T. Kang, and K. G. Neoh, Appl. Surf. Sci., 178, 165 (2001).
-
(2001)
Appl. Surf. Sci
, vol.178
, pp. 165
-
-
Yang, G.H.1
Kang, E.T.2
Neoh, K.G.3
-
16
-
-
0037202047
-
-
W. C. Wang, E. T. Kang, and K. G. Neoh, Appl. Surf. Sci., 199, 52 (2002).
-
(2002)
Appl. Surf. Sci
, vol.199
, pp. 52
-
-
Wang, W.C.1
Kang, E.T.2
Neoh, K.G.3
-
17
-
-
20444501348
-
-
A. L. Dearden, P. J. Smith, D. Y. Shin, N. Reis, B. Derby, and P. O'Brienl, Macromol. Rapid Commun., 26, 315 (2005).
-
(2005)
Macromol. Rapid Commun
, vol.26
, pp. 315
-
-
Dearden, A.L.1
Smith, P.J.2
Shin, D.Y.3
Reis, N.4
Derby, B.5
O'Brienl, P.6
-
18
-
-
47249154785
-
-
M. S. Park, T. H. Lim, Y. M. Jeon, J. G. Kim, S. W. Joo, and M. S. Gong, Macromol. Res., 16, 308 (2008).
-
(2008)
Macromol. Res
, vol.16
, pp. 308
-
-
Park, M.S.1
Lim, T.H.2
Jeon, Y.M.3
Kim, J.G.4
Joo, S.W.5
Gong, M.S.6
-
19
-
-
46449093019
-
-
M. S. Park, T. H. Lim, Y. M. Jeon, J. G. Kim, S. W. Joo, and M. S. Gong, Sens. Actuators B, 133, 166 (2008).
-
(2008)
Sens. Actuators B
, vol.133
, pp. 166
-
-
Park, M.S.1
Lim, T.H.2
Jeon, Y.M.3
Kim, J.G.4
Joo, S.W.5
Gong, M.S.6
-
20
-
-
40949143119
-
-
M. S. Park, T. H. Lim, Y. M. Jeon, J. G. Kim, S. W. Joo, and M. S. Gong, J. Colloid Interf. Sci., 321, 60 (2008).
-
(2008)
J. Colloid Interf. Sci
, vol.321
, pp. 60
-
-
Park, M.S.1
Lim, T.H.2
Jeon, Y.M.3
Kim, J.G.4
Joo, S.W.5
Gong, M.S.6
-
21
-
-
0000968447
-
-
R. Alessio, D. B. Dell'Amico, F. Calderazzo, U. Englert, A. Guarini, L. Labella, and P. Strasser, Helv. Chim. Acta, 18, 219 (1998).
-
(1998)
Helv. Chim. Acta
, vol.18
, pp. 219
-
-
Alessio, R.1
Dell'Amico, D.B.2
Calderazzo, F.3
Englert, U.4
Guarini, A.5
Labella, L.6
Strasser, P.7
-
22
-
-
0242385774
-
-
D. B. Dell'Amico, F. Calderazzo, L. Labella, F. Marchetti, and G. Pampaloni, Chem. Rev., 103, 3857 (2003).
-
(2003)
Chem. Rev
, vol.103
, pp. 3857
-
-
Dell'Amico, D.B.1
Calderazzo, F.2
Labella, L.3
Marchetti, F.4
Pampaloni, G.5
-
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85036889965
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Poly(methylmethacrylate-co-ethyleneglycol dimethacrylate) (3-10 μm. 5% cross-linked) beads were purchased from Aldrich Chem. Co.
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Poly(methylmethacrylate-co-ethyleneglycol dimethacrylate) (3-10 μm. 5% cross-linked) beads were purchased from Aldrich Chem. Co.
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85036870654
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Electroless plating was carried out using a multi-step processes which included: etching, rinsing, conditioning, sensitization, activation, acceleration and electroless silver plating. MMA (5 g) beads were etched in NaOH (1 M, 500 mL) at 70°C for 4 h prior to use, rinsed in distilled water, and conditioned in a solution of PEG-1000 (1 g) and water (500 mL) for 5 min. Surface sensitization was performed by immersing these beads on an aqueous solution containing SnCl2 (2 g) and water (100 mL) for 3 min. Beads were then rinsed in a solution of PdCl2 (1 g) and distilled water (1000 mL) for 3 min, and treated with 10% HCl (the accelerator, They were then rinsed with distilled water and completely dried at 40°C. These pretreated MMA beads (0.5 g) were then dispersed in a solution of PVP (0.1 g)/methanol (40 mL) in a polypropylene container (to avoid silvering of the reaction vessel, To this dispersion was added a solution of silver 2-ethylhexylcarbamate 0.3 g
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2 (1 g) and distilled water (1000 mL) for 3 min, and treated with 10% HCl (the accelerator). They were then rinsed with distilled water and completely dried at 40°C. These pretreated MMA beads (0.5 g) were then dispersed in a solution of PVP (0.1 g)/methanol (40 mL) in a polypropylene container (to avoid silvering of the reaction vessel). To this dispersion was added a solution of silver 2-ethylhexylcarbamate (0.3 g, silver content 10%) in methanol (10 mL) and a solution of hydrazine (0.2 g) in methanol (10 mL) with stirring to increase the density and thickness of the silver coating for 30 min. Finally, the PMMA-Ag composites were filtered and washed with methanol by centrifugation.
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85036865683
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The silver 2-ethylhexylcarbamate complex solution (Ag-EHCB, silver content, 10%) was supplied from Inktec Co. Ltd. (Korea).
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The silver 2-ethylhexylcarbamate complex solution (Ag-EHCB, silver content, 10%) was supplied from Inktec Co. Ltd. (Korea).
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