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Volumn 209, Issue 5, 2009, Pages 2707-2714

Machine vision in detection of corrosion products on SO2 exposed ENIG surface and an in situ analysis of the corrosion factors

Author keywords

Corrosion detection; ENIG surface finish; PCB manufacturing; Quality control

Indexed keywords

ATMOSPHERIC CORROSION; COMPUTER VISION; CORROSION; CUSTOMER SATISFACTION; ELECTRONIC EQUIPMENT MANUFACTURE; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; QUALITY ASSURANCE; QUALITY FUNCTION DEPLOYMENT; SULFUR; SULFUR DIOXIDE; SURFACE PROPERTIES; TOTAL QUALITY MANAGEMENT;

EID: 59549087511     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.06.011     Document Type: Article
Times cited : (12)

References (10)
  • 1
    • 59549083726 scopus 로고    scopus 로고
    • ASTM, 2005. Standard Test Method for Porosity in Gold and Palladium Coatings by Sulfurous Acid/Sulfur-Dioxide Vapor. ASTM B799-95.
    • ASTM, 2005. Standard Test Method for Porosity in Gold and Palladium Coatings by Sulfurous Acid/Sulfur-Dioxide Vapor. ASTM B799-95.
  • 2
    • 0035366292 scopus 로고    scopus 로고
    • Robust online detection of pipeline corrosion from range data
    • Boyer K.L., and Ozguner T. Robust online detection of pipeline corrosion from range data. Mach. Vis. Appl. 12 (2001) 291-304
    • (2001) Mach. Vis. Appl. , vol.12 , pp. 291-304
    • Boyer, K.L.1    Ozguner, T.2
  • 3
    • 0024135404 scopus 로고
    • Electrochemical production and corrosion testing of amorphous Ni-P
    • Carbajal C.S., and White R.E. Electrochemical production and corrosion testing of amorphous Ni-P. J. Electrochem. Soc. 135 (1988) 2952-2957
    • (1988) J. Electrochem. Soc. , vol.135 , pp. 2952-2957
    • Carbajal, C.S.1    White, R.E.2
  • 5
    • 0036076079 scopus 로고    scopus 로고
    • Factors influencing the formation of "Black pad" in electroless nickel-immersion gold solderable finishes-a processing perspective
    • Goosey M. Factors influencing the formation of "Black pad" in electroless nickel-immersion gold solderable finishes-a processing perspective. Circuit World 28 (2002) 36-39
    • (2002) Circuit World , vol.28 , pp. 36-39
    • Goosey, M.1
  • 6
    • 1642362760 scopus 로고    scopus 로고
    • Development of an electroless nickel immersion gold process for PCB final finishes
    • Kwok R.W.M., Chan K.C.M., and Bayes M.W. Development of an electroless nickel immersion gold process for PCB final finishes. Circuit World 30 (2004) 37-42
    • (2004) Circuit World , vol.30 , pp. 37-42
    • Kwok, R.W.M.1    Chan, K.C.M.2    Bayes, M.W.3
  • 7
    • 0012643057 scopus 로고    scopus 로고
    • High corrosion-resistant and long-life span electroless nickel process
    • Liu R., Gao C., and Yang J. High corrosion-resistant and long-life span electroless nickel process. Met. Finish. (2002) 34-37
    • (2002) Met. Finish. , pp. 34-37
    • Liu, R.1    Gao, C.2    Yang, J.3
  • 9
    • 0037080074 scopus 로고    scopus 로고
    • Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications.
    • Rohan J., O'Riordan G., and Bordman J. Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications. Appl. Surf. Sci. 185 (2002) 289-297
    • (2002) Appl. Surf. Sci. , vol.185 , pp. 289-297
    • Rohan, J.1    O'Riordan, G.2    Bordman, J.3
  • 10
    • 33750187709 scopus 로고    scopus 로고
    • Electroless nickel plating process model for plated-through-hole board manufacturing
    • Tenno R., Kantola K., and Tenno A. Electroless nickel plating process model for plated-through-hole board manufacturing. J. Electr. Mater. 35 (2006) 1825-1836
    • (2006) J. Electr. Mater. , vol.35 , pp. 1825-1836
    • Tenno, R.1    Kantola, K.2    Tenno, A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.