Electroless nickel plating process model for plated-through-hole board manufacturing

Journal of Electronic Materials

Volumn 35, Issue 10, 2006, Pages 1825-1836

  Tenno, R ^a   Kantola, K ^a   Tenno, A ^b  

^a AALTO UNIVERSITY   (Finland)

^b TALLINN UNIVERSITY OF TECHNOLOGY   (Estonia)

Author keywords

Electroless plating; Nickel, modeling; State estimation

Indexed keywords

CALIBRATION; ELECTROCHEMISTRY; MATHEMATICAL MODELS; NICKEL; STATE ESTIMATION;

ELECTROCHEMICAL REACTION; MODELING; NICKEL PLATING INDUSTRY;

ELECTROLESS PLATING;

EID: 33750187709     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0164-3     Document Type: Article

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