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Polymer Engineering and Science

Volumn 49, Issue 1, 2009, Pages 104-114

Analysis of mold insert fabrication for the processing of microfluidic chip

(3) Shen, Y K a Lin, J D b Hong, R H b

a School of Dental Technology (Taiwan)

b LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COBALT ALLOYS; DIFFUSION BONDING; FABRICATION; MICROFLUIDICS; MICROOPTICS; MOLDING; MOLDS; PHOTORESISTS; SILICON WAFERS; SURFACE ROUGHNESS; WAFER BONDING;

DEMOLDING; HOT-EMBOSSING; INSERT MATERIALS; MICROFLUIDIC-CHIPS; MOLD INSERTS; PROPERTY; SEED LAYER; SU-8 PHOTORESIST; SU-8 STRUCTURE; UV-LIGHT;

MICROFLUIDIC CHIPS;

EID: 59349096986 PISSN: 00323888 EISSN: 15482634 Source Type: Journal
DOI: 10.1002/pen.21227 Document Type: Article

Times cited : (13)

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