High-precision alignment for low-temperature wafer bonding

Journal of the Electrochemical Society

Volumn 156, Issue 3, 2009, Pages

  Wang, Chenxi ^a   Taniyama, Shingo ^a   Wang, Ying Hui ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT;

ALIGNMENT ACCURACIES; ALIGNMENT MARKS; BONDED WAFERS; CENTROSYMMETRIC; HIGH PRECISION; HIGHLY SENSITIVES; IR MICROSCOPES; LOW-TEMPERATURE WAFER BONDINGS; NANO METER RANGES; ON WAFERS; WAFER-TO-WAFER ALIGNMENTS;

WAFER BONDING;

EID: 59349083199     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3060758     Document Type: Article

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