Low temperature direct electroless nickel plating on silicon wafer

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an

Volumn 32, Issue 1, 2009, Pages 137-140

  Jain, Chao Chi ^a   Wang, Shiuan Sheng ^a   Chuang, Tung Han ^a   Yang, Sang Ray ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Adhesion strength; Electroless nickel; Ethanol pretreatment; Silicon wafer

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); ETHANOL; PLATING; SODIUM FLUORIDE; TEMPERATURE; TUNGSTEN COMPOUNDS;

ELECTROLESS NICKEL; ELECTROLESS NICKEL PLATING; ETHANOL PRETREATMENT; LOW TEMPERATURES; PLATING PROCESS; SODIUM TUNGSTATE;

SILICON WAFERS;

EID: 59049088877     PISSN: 02533839     EISSN: 21587299     Source Type: Journal    
DOI: 10.1080/02533839.2009.9671490     Document Type: Article

References (12)

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