A New Low-Temperature Electroless Nickel Plating Process

Plating and Surface Finishing

Volumn 84, Issue 9, 1997, Pages 80-82

  Chen, K ^a,b   Chen, Y ^b  

^a Ministry of Metallurgical Industry China   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AGENTS; DEPOSITION; ELECTROLESS PLATING; INORGANIC COMPOUNDS; SODIUM COMPOUNDS; SOLUTIONS;

COMPLEXING AGENT; ELECTROLESS NICKEL PLATING PROCESS; SODIUM CITRATE; SODIUM TUNGSTEN; THRESHOLD TEMPERATURE;

NICKEL PLATING;

EID: 0031237262     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. N.V. Mandich & G.A. Krulik, Metal Fin., 90(5), 25 (1992).
2. J.B. Hajdu, Plat. and Surf. Fin., 83, 29 (Sept. 1996).
3. S. John et al., Metal Fin., 80(4), 47 (1982).