High temperature reliability evaluation of CoSb3/electrode thermoelectric joints

Intermetallics

Volumn 17, Issue 3, 2009, Pages 136-141

  Zhao, Degang ^a,b   Li, Xiaoya ^a   He, Lin ^c   Jiang, Wan ^a   Chen, Lidong ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c NONE   (China)

Author keywords

A. Intermetallics, miscellaneous; B. Thermal stability; C. Joining; G. Thermoelectric power generation

Indexed keywords

GROWTH (MATERIALS); GROWTH KINETICS; INTERMETALLICS; JOINING; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR MATERIALS; SHEAR STRENGTH; SINTERING; SPARK PLASMA SINTERING; THERMAL AGING; THERMODYNAMIC STABILITY; THERMOELECTRIC POWER; TITANIUM;

A. INTERMETALLICS, MISCELLANEOUS; B. THERMAL STABILITY; C. JOINING; G. THERMOELECTRIC POWER GENERATION; HIGH TEMPERATURE (HT); INTERMETALLIC COMPOUND (IMC); LAYER STRUCTURES; MICROSTRUCTURE EVOLUTIONS; RELIABILITY EVALUATION; SPARK PLASMAS; TI FOILS;

ELECTROCHEMICAL ELECTRODES;

EID: 58649105770     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2008.10.010     Document Type: Article

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