Stability of dislocation structures in copper towards stress relaxation investigated by high angular resolution 3D X-ray diffraction

Physica Status Solidi (A) Applications and Materials Science

Volumn 206, Issue 1, 2009, Pages 21-30

  Jakobsen, Bo ^a,b   Poulsen, Henning Friis ^a   Lienert, Ulrich ^c   Bernier, Joel ^c,d   Gundlach, Carsten ^a,e   Pantleon, Wolfgang ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b ROSKILDE UNIVERSITY   (Denmark)

^c ARGONNE NATIONAL LABORATORY   (United States)

^d LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^e EUROPEAN SYNCHROTRON RADIATION FACILITY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3D X-RAY DIFFRACTION; DEFORMATION STAGES; DEFORMATION STRUCTURES; DISLOCATION STRUCTURES; ELASTIC STRAIN (ES); HIGH ANGULAR RESOLUTIONS; IN-SITU; LINE PROFILES; LOADING SEQUENCES; OXYGEN FREE HIGH CONDUCTIVITY COPPER (OFHC); RECIPROCAL SPACES; STRAIN DISTRIBUTIONS; SUBGRAIN STRUCTURES; SUBGRAINS; X RAY DIFFRACTION (XRD); X-RAY DIFFRACTION METHOD;

COPPER; DEFORMATION; DIFFRACTION; MICROSTRUCTURE; RESIDUAL STRESSES; STRAIN; STRESS RELAXATION; TENSILE STRENGTH; THREE DIMENSIONAL; UNLOADING; X RAY ANALYSIS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

STRAIN RATE;

EID: 58449096231     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200824257     Document Type: Article

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