Epoxy/nano-silica composites: curing kinetics, glass transition temperatures, dielectric, and thermal-mechanical performances

Journal of Applied Polymer Science

Volumn 111, Issue 2, 2009, Pages 917-927

  Zheng, Yun ^a,b   Chonung, Kim ^a,b   Wang, Genlin ^a,b   Wei, Ping ^a,b   Jiang, Pingkai ^a,b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Shanghai Jiao Tong University   (China)

Author keywords

Dielectric behavior; Enhancement; Epoxy resin; Glass transition temperature; Nano silica particle

Indexed keywords

ACTIVATION ENERGY; AGGLOMERATION; CURING; DIELECTRIC LOSSES; DIELECTRIC MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; FOURIER TRANSFORMS; GLASS; IMPACT STRENGTH; MECHANICAL PROPERTIES; OPTICAL LOSSES; OXIDES; RESINS; SILICA; STRENGTH OF MATERIALS; SUPERCONDUCTING TRANSITION TEMPERATURE; TEMPERATURE; THERMOMECHANICAL TREATMENT;

DIELECTRIC BEHAVIOR; ENHANCEMENT; EPOXY RESIN; GLASS TRANSITION TEMPERATURE; NANO-SILICA PARTICLE;

GLASS TRANSITION;

CURING (CHEMISTRY); DIELECTRIC PROPERTY; EPOXY RESIN; GLASS TRANSITION TEMPERATURE; MATRIX; MECHANICAL PROPERTY; MORPHOLOGY; NANOCOMPOSITE; STRENGTH; THERMAL PROPERTY; TOUGHNESS;

EID: 58449084977     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.28875     Document Type: Article

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